INFO.txt

**This file contains information about the design files contained here.**

***Further modification needed***

**All units are metric.**

> Board materials + specifications
---> Laminate				FR4
---> Layer count			10
---> Total thickness			1.9mm (Can be rounded to 2.0mm if needed. See note in layer stack section.)
---> Length				97.79mm
---> Width				82.55mm
---> Finish type			HASL
---> Copper weight			35 micrometers for all layers
---> Soldermask color			Matte black
---> Silkscreen location		Both sides (top and bottom)
---> Silkscreen color			White
---> Silkscreen type			LPI
---> Impedance matching			10% tolerance
---> Stacked microvias			No
---> Blind vias				No
---> Buried vias			No
---> Minimum drill diameter		0.15mm
---> Minimum annular ring thickness	0.1mm (adding 0.2mm to the vias diameter)
---> Smallest trace width		0.1016mm
---> Smallest spacing			0.0762mm
---> Via in pad				Yes
---> Via plug				None
---> Stencil				Top and bottom (separate)



> Specific layer stack
---> Copper layer 1			0.035mm
---> Prepreg 1				0.1mm
---> Copper layer 2			0.035mm
---> Core 1				0.22mm
---> Copper layer 3			0.035mm
---> Prepreg 2				0.25mm
---> Copper layer 4			0.035mm
---> Core 2				0.15mm
---> Copper layer 5			0.035mm
---> Prepreg 3				0.2mm
---> Copper layer 6			0.035mm
---> Core 3				0.15mm
---> Copper layer 7			0.035mm
---> Prepreg 4				0.25mm
---> Copper layer 8			0.035mm
---> Core 4				0.22mm
---> Copper layer 9			0.035mm
---> Prepreg 5				0.1mm
---> Copper layer 10			0.035mm

---> Total				1.9mm

>Impedance control stack
---> 50 Ohms between copper layer 1-2, 2-3, 7-8, and 8-9.

***If rounding to 2.0mm is needed, round the Prepreg 3 layer to 0.3mm.***