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IPC.Bond

MIT licensed Build status

IPC.Bond is an extension of IPC library that provides inter-process communication using shared memory on Windows with Bond serialization.

Build

The library is developed and maintained with Visual Studio 2019. In order to build the library you will need to do the following:

  1. Restore NuGet packages for IPC.Bond.sln.
  2. Build the Bond (only core C++) submodule using helper bond.cmd script.
  3. Build the IPC submodule using IPC.sln (Transport.csproj only).
  4. Build the IPC.Bond.sln.

Getting Started

Start with examples, C++ and C# tests.

Contributing

This project has adopted the Microsoft Open Source Code of Conduct. For more information see the Code of Conduct FAQ or contact opencode@microsoft.com with any additional questions or comments.

License

Copyright (c) Microsoft Corporation. All rights reserved.

Licensed under the MIT License.