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VQFN-20-1EP_4.5x3.5mm_Pitch0.5mm_HandSoldering.kicad_mod
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VQFN-20-1EP_4.5x3.5mm_Pitch0.5mm_HandSoldering.kicad_mod
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(module VQFN-20-1EP_4.5x3.5mm_Pitch0.5mm_HandSoldering (layer F.Cu) (tedit 57CF31B2)
(fp_text reference REF** (at 0 6.0325) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value VQFN-20-1EP_4.5x3.5mm_Pitch0.5mm_HandSoldering (at 0 -6.477) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.413 1.905) (end -2.667 1.905) (layer F.SilkS) (width 0.15))
(fp_line (start -2.413 1.905) (end -2.413 2.159) (layer F.SilkS) (width 0.15))
(fp_line (start -2.2225 1.397) (end -1.905 1.7145) (layer F.SilkS) (width 0.15))
(fp_line (start -2.2225 1.524) (end -2.032 1.7145) (layer F.SilkS) (width 0.15))
(fp_line (start -2.25 1.75) (end -2.25 -1.75) (layer F.SilkS) (width 0.15))
(fp_line (start 2.25 1.75) (end -2.25 1.75) (layer F.SilkS) (width 0.15))
(fp_line (start 2.25 -1.75) (end 2.25 1.75) (layer F.SilkS) (width 0.15))
(fp_line (start -2.25 -1.75) (end 2.25 -1.75) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -3.65 0.75) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -1.75 3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -1.25 3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -0.75 3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -0.25 3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 0.25 3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 0.75 3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 1.25 3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 1.75 3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 3.65 0.75) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 3.65 -0.75) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 1.75 -3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 1.25 -3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 0.75 -3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 0.25 -3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -0.25 -3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -0.75 -3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -1.25 -3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -1.75 -3.125 90) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at -3.65 -0.75) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at -1.725 0) (size 0.4 0.75) (layers F.Cu F.Paste))
(pad 21 smd rect (at 1.725 0) (size 0.4 0.75) (layers F.Cu F.Paste))
(pad 21 smd rect (at -3.65 0.275) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at -3.65 -0.275) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at 3.65 0.275) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at 3.65 -0.275) (size 3.8 0.2) (layers F.Cu F.Paste F.Mask))
(pad 21 thru_hole rect (at -0.38125 -0.5125) (size 0.7625 1.025) (drill 0.4) (layers *.Cu F.Paste *.Mask))
(pad 21 thru_hole rect (at -0.38125 0.5125) (size 0.7625 1.025) (drill 0.4) (layers *.Cu F.Paste *.Mask))
(pad 21 thru_hole rect (at 0.38125 0.5125) (size 0.7625 1.025) (drill 0.4) (layers *.Cu F.Paste *.Mask))
(pad 21 thru_hole rect (at 0.38125 -0.5125) (size 0.7625 1.025) (drill 0.4) (layers *.Cu F.Paste *.Mask))
(pad 21 thru_hole rect (at 1.14375 -0.5125) (size 0.7625 1.025) (drill 0.4) (layers *.Cu F.Paste *.Mask))
(pad 21 thru_hole rect (at -1.143 -0.5125) (size 0.7625 1.025) (drill 0.4) (layers *.Cu F.Paste *.Mask))
(pad 21 thru_hole rect (at 1.143 0.5125) (size 0.7625 1.025) (drill 0.4) (layers *.Cu F.Paste *.Mask))
(pad 21 thru_hole rect (at -1.143 0.5125) (size 0.7625 1.025) (drill 0.4) (layers *.Cu F.Paste *.Mask))
)